| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC mounting body for which manufacture and material costs are lowered, which hardly contaminates environments without generating toxic components by combustion in the case of performing a processing as waste after use like a resin used at present. SOLUTION: The IC chip mounting body 2 is provided with an IC chip and a base material 3 holding the IC chip is a vulcanized fiber base material using vulcanized fibers to which a high pressure calender processing is already performed, whose surface smoothness is in a range of 50 seconds to 500 seconds by Bekk smoothness stipulated in JIS P8119. Since the smoothness is in the range, a card medium for which quality of printing or the like is excellent and card aptitude is excellent is obtained. |
