METHOD OF MOUNTING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To allow eliminating accumulation of air which causes a distortion at a joint between a semiconductor device and a circuit substrate to mount a semiconductor device in a stable manner. SOLUTION: A method of mounting a semiconductor device 41 on a circuit substrate 31 by face down comprises steps of flattening the circuit substrate 31 by a platy body 11 via an adhesive sheet 21, connecting the semiconductor device 41 to a wiring unit 32 of the circuit substrate 31, and separating the circuit substrate 31 to which the semiconductor device 31 is connected from the platy body 11. Air paths 13 are formed between the circuit substrate 31 and the adhesive sheet 21, and between the adhesive sheet 21 and the platy body 11.