| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of parts comprising a camera module and realize the reduction of thickness and weight. SOLUTION: A CCD 24 is mounted onto the rear surface of a first semiconductor module 20 where an DSP 32A or the like for processing electric signals of the CCD 24 is built in. A second semiconductor module 21 having a cavity in a part corresponding to the CCD 24 is mounted onto the rear surface of the first semiconductor module 20. A lens 23 is provided on the upper side of the cavity 27. Thus, a camera module 28 can be formed of bare minimum of elements. As a result, the camera module 28 can be made small in thickness and light in weight. |
