| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition utilizable as the interlayer dielectric of a multilayer wiring board. SOLUTION: The patternable photosensitive resin composition is characterized in that it contains at least one resin having a weight average molecular weight of 1,000-500,000, at least one photopolymerizable monomer or oligomer having at least two (meth)acryloyl groups of formula (I) (where R is H or methyl) in one molecule and having a chain structure consisting of only carbon and hydrogen atoms and a photopolymerization initiator for initiating polymerization of the polymerization monomer on irradiation with active energy beams. |
