| 摘要 |
PROBLEM TO BE SOLVED: To solve problems such as adhesion of oxides of the solder or carbonized flux in soldered regions, generation of solder projections, bridges, or unsoldering, or insufficient invasion of solder into the inside of through holes, in conventional methods of partially soldering a printed board. SOLUTION: This method is constituted such that, before molten solder contacts the regions to be soldered of a printed board, molten solder is jetted from a wave nozzle to clean the inside of the wave nozzle, by removing oxides of solder or carbonized flux adhering thereon by the jetted molten solder while the wave nozzle is sufficiently preheated by the molten solder, and thereafter the wave of molten solder preheats the part to be soldered, and then regularly heats the same.
|
