发明名称 LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME
摘要 The present invention disclosed a light emitting diode (LED) and method for manufacturing the same. The light emitting diode includes a transparent substrate connected to an epitaxial layer with absorption substrate via a transparent adhesive layer. Then, the absorption substrate is removed to form a light emitting diode with the transparent substrate. Because of the low light absorption of the transparent substrate, the present invention provides high luminescence efficiency. Furthermore, because the first metal bonding layer is electrical connected with the first ohmic contact layer by the electrode connecting channel, the voltage is decreased and the current distribution is increased in the fixed current to improve the luminous efficiency of a light emitting diode.
申请公布号 US2003047737(A1) 申请公布日期 2003.03.13
申请号 US20020200767 申请日期 2002.07.22
申请人 LIN JIN-YWAN;YANG KUANG-NENG 发明人 LIN JIN-YWAN;YANG KUANG-NENG
分类号 H01L21/205;H01L33/00;H01L33/06;H01L33/30;H01L33/38;(IPC1-7):H01L21/00;H01L27/15;H01L31/12 主分类号 H01L21/205
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