发明名称 |
Method of manufacturing multilayer modules |
摘要 |
A method fabricates multilayer modules with flexible substrates. The method includes stacking a plurality of active layer sheets and a plurality of segmentation layer sheets with adhesive between the layer sheets, thereby assembling an arrayed module pre-form. Each segmentation layer sheet includes a thermally-conductive material. The method further includes stacking a plurality of arrayed module pre-forms with at least one segmentation layer sheet between each pair of arrayed module pre-forms and with a thermoplastic adhesive material applied to the segmentation layer sheets. The method further includes laminating the active layer sheets and the segmentation layer sheets together, cutting the stack of arrayed multilayer modules, forming electrically-conductive lines along at least one side of the stack of multilayer modules, and segmenting the stack of multilayer modules into individual multilayer modules.
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申请公布号 |
US2003049889(A1) |
申请公布日期 |
2003.03.13 |
申请号 |
US20010949203 |
申请日期 |
2001.09.07 |
申请人 |
YAMAGUCHI JAMES SATSUO;PEPE ANGEL ANTONIO;OZGUZ VOLKAN H.;CAMIEN ANDREW NELSON |
发明人 |
YAMAGUCHI JAMES SATSUO;PEPE ANGEL ANTONIO;OZGUZ VOLKAN H.;CAMIEN ANDREW NELSON |
分类号 |
H01L23/373;H01L25/065;H01L25/10;H05K3/00;H05K3/40;(IPC1-7):H01L21/44;H01L21/50;H01L21/48 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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