Process and device for separating semiconductor chips attaches wafer to flexible carrier and bends it under pressure differential in a chamber

摘要

A process for separating semiconductor chips from a wafer comprises attaching the wafer (1) to a flexible carrier (2), cutting the required dividing grooves in the wafer, placing the wafer in a pressure chamber (3) and applying a pressure differential across the carrier to flex it and so divide the wafer into chips. An Independent claim is also included for a device to perform the above process.