| 摘要 |
PROBLEM TO BE SOLVED: To provide a material for electronic component firing prepared by covering the surface of a substrate with a zirconia layer, which can solve the problems of exfoliation of the zirconia layer and lack of strength thereof being found in a conventional material and can be produced economically. SOLUTION: This material for electronic components firing is prepared by covering a brick or porcelainous substrate with the zirconia layer which is formed by bonding coarse zirconia particles having an average particle diameter of 30-500 μm and fine particles having the average diameter of 0.1-10 μm with a partially melting binder comprising two or more metal oxides. In this case, the weight ratio of the coarse particle to the sum of the fine particle and binder is made to be 75:25 to 25:75, and that of the binder to the sum of the coarse/fine particles and binder is regulated to be 0.5% or more but less than 3%. By firing the coarse particles or the mixture of coarse and fine particles using the binder comprising yttrium oxide and aluminum oxide, the bonding strength of the zirconia layer and the adhesiveness thereof to the substrate can be improved, thus obtaining the high performance material for electronic component firing. |
