| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition having excellent heat resistance, low thermal expansibility and excellent flame retardance, to provide a prepreg, and to provide a printed circuit board. SOLUTION: This resin composition contains a cyanate resin and/or its prepreg, an epoxy resin, and an inorganic filler as essential components. The prepreg is obtained by impregnating a substrate with the resin composition. The printed circuit board is obtained by laminating the prepregs and then subjecting the laminate to a thermal pressure molding treatment.
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