CURABLE COMPOSITION AMD CURED MATERIAL

摘要

PROBLEM TO BE SOLVED: To obtain a curable composition providing a cured material having balanced curability/moldability and a low coefficient of linear expansion. SOLUTION: This curable composition comprises (A) an organic compound containing at least two carbon-carbon double bonds having reactivity with a SiH group in one molecule, (B) a compound containing at least two SiH groups in one molecule and (C) a hydrosilylation catalyst as essential components. The component (A) is composed of (a) an electron donative group to be linked by a hydrogen bond and (b) a fluorine atom, a nitrogen atom and a hydrogen atom bonded to an oxygen atom.