发明名称 |
FILM ADHERING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a film adhering method in which a film of multi-layer structure can be adhered to substrates transferred in sequence under a high tact time in compliance with an outer shape of each of the substrates. SOLUTION: There is provided a film adhering method in which a multi-layer film having a width coinciding with a width of substrates fed out of a film roll and having at least an adhering layer and a base film is adhered to the substrates transferred in sequence with the adhering layer. This method is comprised of a half-cut stage in which the adhering layer of the multi-layer film is cut in a width direction at the adhering layer of the multi-layer film in compliance with a space between the substrates transferred in sequence between a pair of depressing rolls; an adhering stage in which the substrates and the half-cut multi-layer film are transferred between the depressing rolls and the adhering layer is adhered to the substrate; and a separating stage in which the multi-layer film is cut by the second cutter in a width direction between the substrates at a subsequent stage of each of the depressing rolls.
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申请公布号 |
JP2003072724(A) |
申请公布日期 |
2003.03.12 |
申请号 |
JP20010256384 |
申请日期 |
2001.08.27 |
申请人 |
HITACHI INDUSTRIES CO LTD |
发明人 |
HAYASHI TAKEHIKO;TAKAHARA TAKESHI;KUNIHIRO TATSUTO |
分类号 |
B65C9/30;B65C1/02;(IPC1-7):B65C9/30 |
主分类号 |
B65C9/30 |
代理机构 |
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代理人 |
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地址 |
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