Sn-PLATED EXTRA FINE COPPER WIRE, STRAND WIRE USING THE SAME, AND METHOD FOR MANUFACTURING Sn-PLATED EXTRA FINE COPPER WIRE

摘要

PROBLEM TO BE SOLVED: To provide a Sn-plated extra fine copper wire having a satisfactory stranding property and soldering property, provide a strand wire using the same, and provide a method for manufacturing Sn-plated extra fine copper wire. SOLUTION: In a Sn-plated extra fine copper wire with a diameter of 0.1 mm or less, the objective copper wire 11 is characterized by having a Cu-base plated layer 13 containing Sn of 0.2-0.7 mass% with layer thickness of 0.05μm or more, around the extra fine copper wire 12 consisting of copper or a copper alloy.