发明名称 METHOD OF FORMING ELECTRODE ON SUBSTRATE HAVING VERY SMALL THREE-DIMENSIONAL STRUCTURE AND MICROCHIP MANUFACTURED THEREBY
摘要 PROBLEM TO BE SOLVED: To provide a method of forming an electrode on a substrate having an inexpensive, efficient, and very small three-dimensional structure by which an electrode maintained in a desirable electrically connected state over a desired extent can be formed in a desired pattern even when the electrode has a three- dimensional shape by utilizing the conventional device, and to provide a microchip manufactured by the method. SOLUTION: At the time of forming the electrode on the substrate having the very small three-dimensional structure composed of a very small recessed and projecting section, groove section, etc., by this method, an electrode forming material layer maintained in a conductive state is formed from one internal wall surface of the structure to the bottom sections of the structure positioned on both sides of the structure and the surface of a substrate. The microchip is manufactured by this method.
申请公布号 JP2003075459(A) 申请公布日期 2003.03.12
申请号 JP20010266031 申请日期 2001.09.03
申请人 JAPAN SCIENCE & TECHNOLOGY CORP;KANAGAWA ACAD OF SCI & TECHNOL;KANAGAWA PREFECTURE 发明人 SUZUKI KOJI;KITAMORI TAKEHIKO;ITO TAKESHI
分类号 G01N27/30;G01N37/00;(IPC1-7):G01N37/00 主分类号 G01N27/30
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