LIQUID COOLED HEAT SINK FOR COOLING ELECTRONIC COMPONENTS

摘要

A liquid cooled heat sink for cooling heat generating components. The heat sink has a base member with open ended channels formed in at least one surface thereof. The open ends of the channels have a span less than a span across a lower portion of the channels. A fluid conduit is disposed in said channels. The fluid conduit has an outer span greater than the span across the open ends of the channels and a flattened surface which is substantially coplanar with the surface of the heat sink base member having the channels therein.