发明名称 |
LIQUID APPLYING METHOD, LIQUID APPLYING DEVICE AND METHOD AND DEVICE FOR MANUFACTURING CATHODE RAY TUBE USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a liquid applying method, a liquid applying device and a method and device for manufacturing cathode ray tube using the same which causes no bubble irregularity and realizes a uniform coating surface. SOLUTION: This liquid applying device is provided with an applying means 4 which applies a coating solution, a coating solution supplying means 5 which supplies the coating solution to the applying means 4, a bubble removing means 41 which collects bubbles in the supplied coating solution into the upper part and removes the same and a coating solution circulating means 5 which circulates the coating solution in the applying means 4.
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申请公布号 |
JP2003071368(A) |
申请公布日期 |
2003.03.11 |
申请号 |
JP20010270436 |
申请日期 |
2001.09.06 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
KOMYOJI DAIDO;AOKI NOBUYUKI;MITANI MASATO;MATSUDA NAOKO;NAKA HIROYUKI |
分类号 |
B05D3/00;B05C5/00;B05C11/10;B05D7/22;H01J9/227;(IPC1-7):B05C11/10 |
主分类号 |
B05D3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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