发明名称 |
Chip photoelectric sensor assembly and method for making same |
摘要 |
A chip photoelectric sensor assembly includes a substrate with a printed circuit board mounted thereon. A photoelectric sensor chip is provided with a plurality of photoelectric sensors and is mounted on the substrate such that the photoelectric sensor chip is electrically connected with the substrate. The photoelectric sensors of the photoelectric sensor chip are masked by a photosensitive protective layer made of a photosensitive hard coating material. The photosensitive protective layer has a thickness ranging between 1 and 10 microns. The very thin photosensitive protective layer is thus capable of minimizing the light refraction distortion.
|
申请公布号 |
US6531333(B2) |
申请公布日期 |
2003.03.11 |
申请号 |
US20010881757 |
申请日期 |
2001.06.18 |
申请人 |
LIN HONG-MING;BAI JIN-CHUAN |
发明人 |
LIN HONG-MING;BAI JIN-CHUAN |
分类号 |
H01L21/00;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|