| 摘要 |
PROBLEM TO BE SOLVED: To form a ground pattern having good earth performance while the number of layers is reducing as much as possible in a printed wiring board. SOLUTION: A printed wiring board comprises a land for mounting a component for bridging a signal line and a ground line, formed as a component for three-dimensional intersection for intersecting different types of lines such as signal lines, power source lines, a ground line and the like on a surface of a rear side thereof for mounting a grid array package.
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