MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce defective products due to a cobwebbing phenomenon of an adhesive or the like in a pellet bonding process. SOLUTION: In an applying process of a paste such as an adhesive 40 prior to the pellet bonding process, after the adhesive 40 is applied from a paste nozzle 13 onto a tab 21 of a lead frame 20, the paste nozzle 13 is raised as it is rotated so that a cobwebbing part 41 due to the viscosity of the adhesive 40 is surely wrung off to prevent generation of a application failure or a bonding failure caused by falling or scattering of the cobwebbing part 41.