| 摘要 |
PROBLEM TO BE SOLVED: To secure sufficient airtightness between an Ni-plated cap and a seal ring of an electronic component constituted by putting an element chip in a ceramic-made chip carrier and sealing the element chip by welding the cap to the seal ring on the top surface of the chip carrier. SOLUTION: The surface acoustic wave element chip 3 is put in a recessed part of the ceramic-made chip carrier 2 having the recessed part. The Kovar- made seal ring 4 s joined with the top surface of the chip carrier 2 by using a brazing material, etc., so as to surround the recessed part opening of the chip carrier 2. The top surface of the Kovar-made metal cap 5 mounted on the seal ring 4 is plated with Ni, and the Ni plating is used as the brazing material to join the metal cap 5 with the seal ring 4 by seal welding. When the Ni plating is 1 to 2 μm in thickness, the airtightness between the metal cap 5 and seal ring 4 can be made excellent. |
