| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink that can be improved in heat radiating effect and to provide an insertion body of the heat sink. SOLUTION: The heat sink 15 is composed of a cover type shell-like body, can cover one or more semiconductor chips 11, and has outwardly protruded inserted pins 151 in its outer peripheral section. The head ends 153 of the pins 151 have openings 152, and the pins 151 have necks 154 on their outsides. The insertion body has the heat sink 15 and one or more semiconductor chips 11 joined to a receiving plate 14. The plate 14 has prescribed through holes 142, and the upper surfaces of the chips 11 are coated with heat-conductive glue 13. The pins 151 of the heat sink 15 are inserted into the through holes 142 of the receiving plate 14 until the heads of the pins 151 pass through the plate 14, and the necks 154 of the pines 151 are locked by the holes 142. Prescribed earthing-layer circuit 141 are formed in the receiving plate 14 and electrically connected to the through holes 142, respectively. |
