| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit device having a low parasitic inductance and exhibiting distinguished vibration resistance and impact resistance while reducing the labor required for manufacturing and assembling work in which dissipation of heat generated in an intermediate circuit and/or a connection element to a cooling body is enhanced. SOLUTION: An intermediate circuit board 24 has an element 56 for coming into direct contact with an attached conductor passage with a low inductance. The intermediate circuit board 24 and at least one substrate 16 are attached, respectively, with an AC connection element 20 having a contact element. |
