发明名称 CONDUCTIVE FINE PARTICLE AND CONDUCTIVE CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a conductive fine particle and a conductive connection structure capable of keeping the distance between facing boards or the like constant because of having an extremely narrow particle diameter distribution, having so excellent elasticity as to prevent stress from being easily imposed on a jointing part when it is used for a conductive joint, and capable of relaxing shearing stress due to displacement of a relative position between electrodes caused by thermal expansion and contraction of a board, an element or the like due to temperature variation. SOLUTION: This conductive fine particle is formed by covering the surface of a base material fine particle formed of a resin with a one or more metal layers. In the conductive fine particle, the particle diameter of the base material fine particle is distributed in a range of 95-105% of the average particle diameter of the base material fine particle.
申请公布号 JP2003068143(A) 申请公布日期 2003.03.07
申请号 JP20010253086 申请日期 2001.08.23
申请人 SEKISUI CHEM CO LTD 发明人 OKUDA MASAMI;OKINAGA NOBUYUKI
分类号 H01R11/01;H01B5/00;H05K3/34;(IPC1-7):H01B5/00 主分类号 H01R11/01
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