| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate 1 for mounting electronic part where solder- creep-up property is not degraded in a flow soldering method. SOLUTION: This substrate is provided with at least one via hole that is arranged to penetrate a substrate 1 adjacent to a through hole 3, and allows a heated and melted solder 12 to enter its inner space as a peripheral through hole when the solder 12 as a heated and melted joint material enter the through hole 3. When the heated and melted joint material enters the inner space of the via hole 4, a heat is supplied to a copper foil (a part of surrounding wall) 5 forming the through hole 3. Thus, the solder 12 is prevented from being cooled when it enters the inside of the through hole 3, so that the solder-creep-up property can be improved.
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