ULTRASONIC BONDING DEVICE AND ULTRASONIC BONDING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an ultrasonic bonding device and an ultrasonic bonding method which can improve productivity by automating polishing and washing operations for a bonding tool. SOLUTION: A polishing portion 6 provided with a polishing face at a side direction of a work supporting portion 2 and a washing portion 7 provided with a vessel to store a washing liquid are arranged in the ultrasonic bonding device to bond an electronic part by the bonding tool 10 provided with an ultrasonic piezoelectric transducer 11. In a process where a bonding operation is repeated, after a bonding action face 10b of the bonding tool 10 is polished by the polishing portion 6, the bonding action face 10b is ultrasonically washed by applying an ultrasonic vibration to the bonding tool 10 in a state of immersing the bonding action face 10b after the polishing in the washing liquid in the vessel. This allows a washing operation of a bonding action portion 10a after polished to be automated and to improve the productivity.