| 摘要 |
PROBLEM TO BE SOLVED: To bring a circuit board and a base for placing a semiconductor element to the state in which the circuit board and the base can be mounted by bringing the circuit board and the base near to the upper-side main surface of a base body, to extremely shorten the length of a bonding wire and a ribbon electrically connecting a wiring conductor for the circuit board and an electrode for the semiconductor element, and to obtain excellent electrical characteristics in which the transmission loss of a high-frequency signal is reduced. SOLUTION: A substrate for loading the semiconductor element in which the base 4 for placing the semiconductor element 6 and the circuit board 1 in which the wiring conductor 2 is formed on a top face and brazed on the upper-side main surface of the base body 3 respectively so as to be brought near and arranged. An inclined plane 9 formed by notching an edge section between the underside of the circuit board 1 and an end face on the base 4 side is formed in the circuit board 1. |
