发明名称 ADHESIVE STRENGTH MEASURING METHOD, LAMINATION FILM AND SEMICONDUCTOR ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide an adhesive strength measuring method which can measure peel strength when an upper layer film is thin and hard, and has little irregularity and high reproducibility. SOLUTION: A specimen is formed which has a prescribed width and is composed of a substrate, a first film formed on the substrate, a second film formed on the first film and a resin film formed on the second film. After an interface of the first film and the second film of the specimen is partly peeled, the substrate is fixed. By using a tension tester, end portions of the second film and the resin film which are partly peeled are pulled to the substrate surface by a prescribed distance, at a prescribed pulling angle and a prescribed speed. A tensile load necessary for peeling the interface of the first film and the second film is measured over a prescribed distance. In the adhesive strength measuring method of the lamination film composed of the first film and the second film laminated on the first film, an average value of the tensile load per a unit width of the specimen in the prescribed distance is the peel strength.
申请公布号 JP2003068847(A) 申请公布日期 2003.03.07
申请号 JP20010254655 申请日期 2001.08.24
申请人 HITACHI CHEM CO LTD 发明人 NARITA TAKENORI;HASHIMOTO MASAHIRO
分类号 H01L21/768;H01L23/522;(IPC1-7):H01L21/768 主分类号 H01L21/768
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