发明名称 Electronic parts assembling and testing method, and electronic circuit baseboard manufactured by the method
摘要 A method for assembling and testing an electronic circuit baseboard includes at least a step of soldering at least one electronic part to an electronic circuit baseboard using Pb excluded solder. One of erroneous wiring, erroneous mounting, malfunction, and defective soldering of the least one electronic part is tested by contacting a probe pin to various probe pin contact sections on the electronic circuit baseboard. During the step of soldering, the Pb excluded solder is also supplied to at least one of the various probe pin contact sections in order to suppress oxidation thereof.
申请公布号 US2003042289(A1) 申请公布日期 2003.03.06
申请号 US20020235826 申请日期 2002.09.06
申请人 NEGISHI TAKASHI;MUKAI KATSUHIKO;NAKAGAWA HIROMITSU 发明人 NEGISHI TAKASHI;MUKAI KATSUHIKO;NAKAGAWA HIROMITSU
分类号 B23K1/012;H05K1/02;H05K3/34;(IPC1-7):B23K31/12 主分类号 B23K1/012
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