| 摘要 |
<p>An optoelectronic device includes two optical subassemblies (42, 52) mounted on an edge (70) of a substrate (68). Electronic circuitry is mounted on the substrate. The two optical packages are electrically connected to the electrical circuitry. An optical coupling element (46) is attached to one of the optical packages and another optical coupling element (56) is attached to the other optical package. A rib (50) is attached to the substrate and to one of the optical coupling elements so as to provide support for the optical coupling element, and another rib (60) is attached to the substrate and to the other optical coupling element. Each optical coupling element has a respective ferrule receiving bore (48, 58). The ferrule receiving bores are parallel to one another. A connection pin header (80) is electrically connected to the electronic circuitry on the substrate. The connection pin header includes connection pins (82).</p> |
