发明名称 Metal-less bond grinding stone, and electrolytic dressing grinding method and apparatus using the grinding stone
摘要 There is here disclosed a metal-less bond grinding stone for protrusion of grains on the grinding stone by electrolytic dressing, comprising abrasive grains and a bond portion for holding the abrasive grains, wherein the bond portion comprises a carbon-containing nonmetallic material alone. Furthermore, this metal-less bond grinding stone is used, whereby a current which is allowed to flow between the grinding stone and the electrode is controlled within a desired range. In this way, environmental pollution with a waste liquid containing heavy metal ions and metal contamination of device wafers can be prevented, and a mirror-like high-quality level ground surface can be obtained with a satisfactory efficiency.
申请公布号 US2003045222(A1) 申请公布日期 2003.03.06
申请号 US20020229069 申请日期 2002.08.28
申请人 RIKEN 发明人 OHMORI HITOSHI;ITOH NOBUHIDE;KATAHIRA KAZUTOSHI;ONO TERUKO;HOKKIRIGAWA KAZUO
分类号 B24B53/12;B23H5/08;B24B7/22;B24B53/00;B24D3/02;B24D3/28;B24D3/34;(IPC1-7):B24B1/00 主分类号 B24B53/12
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