Metal-less bond grinding stone, and electrolytic dressing grinding method and apparatus using the grinding stone

摘要

There is here disclosed a metal-less bond grinding stone for protrusion of grains on the grinding stone by electrolytic dressing, comprising abrasive grains and a bond portion for holding the abrasive grains, wherein the bond portion comprises a carbon-containing nonmetallic material alone. Furthermore, this metal-less bond grinding stone is used, whereby a current which is allowed to flow between the grinding stone and the electrode is controlled within a desired range. In this way, environmental pollution with a waste liquid containing heavy metal ions and metal contamination of device wafers can be prevented, and a mirror-like high-quality level ground surface can be obtained with a satisfactory efficiency. <IMAGE>