| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a copper-resin composite material. SOLUTION: This forming method includes a stage (1) wherein a palladium or palladium-tin catalyst is deposited on a resin substrate, a stage (2) wherein, without performing accelerating treatment for the catalyst after the stage (1), the resin substrate with the catalyst deposited is treated with an electroless copper plating solution containing copper ions and a reducing agent to deposit a copper thin film on the resin substrate, a stage (3) wherein, after the stage (2), and also, before the deposition of an oxide film on the surface of the copper thin film on the resin substrate, the resin substrate having the copper thin film is subjected to electrolytic copper plating treatment to form a copper-resin composite intermediate material, a stage (4) wherein, after the stage (3), the copper-resin composite intermediate material is subjected to etching treatment or grinding treatment, and a stage (5) wherein, after the stage (4), the copper- resin composite intermediate material subjected to the etching treatment or grinding treatment is subjected to electrolytic copper plating treatment or pattern formation treatment. |
