| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulating resin composition having high strengths of adhesion with a circuit conductor and good solder heat resistance by securing flame retardancy without using halide and using a stable high alkaline bath during production of a multilayer wiring board. SOLUTION: The insulating resin composition comprises (1) a resin having an unsaturated double bond, (2) a photoinitiator for reacting the unsaturated double bond by UV irradiation, (3) a bismaleimide compound, (4) aluminum hydroxide, (5) an inorganic filler coated with zinc molibdate and (6) a comb- shaped graft polymer as essential components. |
