LAMINATE WITH RESIN AND MULTILAYERED PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a laminate with a resin capable of being used for manufacturing a multilayered printed wiring board enhanced in strength such as elastic modulus or the like and having high interlaminar insulating properties of a circuit. SOLUTION: A resin layer 2 meltable under heating and having thermosetting properties is laminated on a laminated sheet 1 reinforced using at least one of a fabric and a nonwoven fabric as a substrate. In manufacturing the multilayered printed wiring board using the laminate with the resin, the interlaminar insulating layer of the circuit can be formed by the laminated sheet 1 and the resin layer 2.