发明名称 PRE-TREATMENT OF ELECTROLESS PLATING
摘要 PROBLEM TO BE SOLVED: To improve the selectivity of electroless plating by removing negative charge on the surface of an insulating film of a substrate. SOLUTION: A pre-treatment of electroless plating for forming a plating film on the substrate 51 by electroless plating is carried out to remove negative charge on the surface of the substrate 51 by applying AC power from an AC power source 18 on the surface of the substrate 51 opposite from the surface on which the plating film of the substrate 51 is formed by dipping the substrate 51 into an electrolyte 41. As the pre-treatment, the negative charge on the surface of the substrate 51 may be removed by applying DC bias power while applying AC power or may be removed while applying pulse power.
申请公布号 JP2003064479(A) 申请公布日期 2003.03.05
申请号 JP20010250962 申请日期 2001.08.22
申请人 SONY CORP 发明人 KITO HIDEYOSHI;NOGAMI TAKESHI;TAGUCHI MITSURU;KOMAI HISANORI
分类号 C23C18/18;C23C18/16;H01L21/288;H01L21/3205;H01L23/52;(IPC1-7):C23C18/18;H01L21/320 主分类号 C23C18/18
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