Semiconductor package having heat sink attached to substrate

摘要

A semiconductor package having a heat sink attached to a substrate is provided. The semiconductor package includes a substrate for mounting at least one semiconductor chip thereon; wherein the semiconductor chip is electrically connected to the substrate and a plurality of positioning holes formed on the substrate for being engaged with a plurality of positioning portions formed on the heat sink, allowing the heat sink to be securely fixed to the substrate. Thus dislocation of the heat sink on the substrate can be effectively prevented during the molding process.