发明名称 |
SUBSTRATE TREATMENT APPARATUS AND CONVEYANCE APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To prevent dust particles from being whirled due to an air current generated when a conveyance apparatus is run in a substrate treatment apparatus represented by a semiconductor manufacturing apparatus. SOLUTION: Partition plates 5a and 5b are provided to restrain the dust particles from being moved between a transfer part 201 and a running part 203 in the conveyance apparatus 200 used to convey a substrate. |
申请公布号 |
JP2003060001(A) |
申请公布日期 |
2003.02.28 |
申请号 |
JP20010248114 |
申请日期 |
2001.08.17 |
申请人 |
HIRATA CORP |
发明人 |
KAMICHIKA TETSUO |
分类号 |
B65G49/00;B65G49/06;B65G49/07;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
B65G49/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|