发明名称 SUBSTRATE TREATMENT APPARATUS AND CONVEYANCE APPARATUS
摘要 PROBLEM TO BE SOLVED: To prevent dust particles from being whirled due to an air current generated when a conveyance apparatus is run in a substrate treatment apparatus represented by a semiconductor manufacturing apparatus. SOLUTION: Partition plates 5a and 5b are provided to restrain the dust particles from being moved between a transfer part 201 and a running part 203 in the conveyance apparatus 200 used to convey a substrate.
申请公布号 JP2003060001(A) 申请公布日期 2003.02.28
申请号 JP20010248114 申请日期 2001.08.17
申请人 HIRATA CORP 发明人 KAMICHIKA TETSUO
分类号 B65G49/00;B65G49/06;B65G49/07;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65G49/00
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