发明名称 |
SEMICONDUCTOR MANUFACTURING APPARATUS, CHAMBER THEREFOR, AND METHOD OF REGENERATING CHAMBER THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus, a chamber for the apparatus, and a method for regenerating a chamber for the apparatus which can suppress wear of constituent components of the chamber, metal contamination and generation of particles within the chamber. SOLUTION: An etching apparatus 1 includes a chamber 5 which has a lower chamber body 2, an upper chamber main body 3, and a doom 4. A wafer stage 6 for supporting a wafer to be etched thereon is disposed within the chamber 5. A coil antenna 13 is provided along an outer periphery of the dome 4. A source radio frequency (RF) power source 15 is connected to the coil antenna 13 via a radio frequency (RF) matching box 14. A bias high frequency power source 17 is connected to the wafer stage 6ss via a radio frequency matching device 16. A film layer 18 of Y2 O3 is formed on an inner wall surface of the dome 4 as a site corresponding to a plasma generation region P in the chamber 5.
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申请公布号 |
JP2003059904(A) |
申请公布日期 |
2003.02.28 |
申请号 |
JP20010232482 |
申请日期 |
2001.07.31 |
申请人 |
APPLIED MATERIALS INC |
发明人 |
SUZUKI AKIRA;NISHIZAWA TAKANORI;NAKAMURA TAKAYUKI;UO YASUHIRO |
分类号 |
H01L21/302;H01L21/205;H01L21/304;H01L21/3065;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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