| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer support body, where surface defects such as slippages and a scratch will not occur in a wafer having a diameter of not less than 200 mm, especially those with less than 300 mm, and to provide a boat for heat treatment by using the wafer support body. SOLUTION: The ring-like or horseshoe-like wafer support body has an upper flat part. A ring-like or horseshoe-like inner peripheral upper corner is chamfered, so that the width of a chamfering part becomes 0.1 to 4 mm and the surface roughness Ry of the chamfered part and the upper flat part becomes not more than 5μm.</p> |
