| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip inductor, where a board is hardly warped, a coil conductor and interlayer insulating layers are hardly separated, cracking hardly occurs in the board, a production process can be simplified, and a manufacturing cost can be reduced even if the laminated layers are increased in number. SOLUTION: Coil conductors 11, 12 and 15, 16 are electrically connected together through the intermediary of interlayer insulating layers 13 and 14 where viahole electrodes are provided to form a first coil unit 3 and a second coil unit 4 on the first and second main surface, 2a and 2b, of a board 2 respectively for the formation of an inductor 1.
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