| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding method of a circuit element and a manufacturing method of an electric circuit device. SOLUTION: The bonding method of a light-emitting diode 52 in which, a resin layer 53 holding the light-emitting diode 52 is turned to a chip by removing a part of it, and then, the resin chip 54 thus made is separated as organic deposits 81 generated at time of a chip making is left adhered on the resin layer 53, after which, the separated resin chip 54 is made bonded to a wiring circuit board 55 under heating by laser irradiation while a selective heating is substantially made of an adhesive layer 76 by heat-absorbing effect of the organic deposits 81, as well as the manufacturing method of an image display device accompanied by this bonding process are introduced. |
