| 摘要 |
PROBLEM TO BE SOLVED: To provide an LOC.IC which is improved in moisture resistance and equipped with a resin sealing body that can be collectively molded. SOLUTION: The method of manufacturing an LOC.IC comprises a first process of preparing a chip 1 equipped with pads 3 provided on the one main surface, a second process of preparing a multi-lead frame composed of a plurality of unit lead frames each equipped with a plurality of cranked inner leads, a third process of bonding the chip 1 to the inner leads 14 with an insulating tape 4, a fourth process of connecting a wire 5 between the pad 3 and the inner lead 14, a fifth process of sealing up a plurality of unit lead frames collectively in a resin sealing body 17 while the chip 1 is uncovered on the one main surface of the resin sealing body 17 and the inner leads 14 are uncovered on the other main surface, and sixth process of cutting off the resin sealing body 17 by the unit lead frame to manufacture a separate LOC.IC. Therefore, this method can be set higher in productivity than a usual method where resin sealing bodies are separately molded, the leakage path of the inner lead to a wire bonded part can be elongated, and the LOC.IC can be improved in moisture resistance. |
