| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for mounting an electronic component which can execute a mounting operation of each component in parallel with a work of processing to recognize images of suction holding states of all the components, even if the process of recognizing the image of the suction holding states of all the components are not completed and which can improve productivity, by efficiently shortening a time required for mounting the component. SOLUTION: The method for mounting the electronic component comprises the steps of imaging all the images of a plurality of the electronic components sucked and held, processing to sequentially recognize the suction holding states of the respective components, according to the respective images in order of mounting the components on a circuit board, and sequentially mounting the components, in which the processing is successively finished in the step of the processing in the above order, on the board. |
