| 摘要 |
PROBLEM TO BE SOLVED: To provide a board-mounting method for keeping stable soldering quality, without using screen, at mounting of the small and high-density printed board in a small pitch. SOLUTION: A pattern negative layer 12 is formed on the printed board 11 and electronic components 5 are mounted on the printed board 11 by soldering using flux. A step for forming a resist coat layer 13 on a part, where the electronic components 5 are not mounted on the pattern negative layer 12 and forming a solder plate layer 14, on a part where the electronic components 5 are mounted on the pattern negative layer 12, and a step for applying flux onto the upper face of the resist coat layer 13 and the upper face of the solder plated layer 14 and forming a flux film are given.
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