| 摘要 |
<p>A microelectronic package (100) comprises a first level substrate 102 such as a flip-chip which includes a plurality of microelectronic devices, a thin film decal (110), an adhesive layer (130) and a second level substrate (120) such as a printed circuit board (120). The thin film decal includes an internal wiring layer (114), which connects solder bumps (104) on the first level substrate with conductive vias (132) in the adhesive layer. The conductive vias in the adhesive layer connect to substrate vias (124) in the second level substrate. The thin film decal may be made using semiconductor lithography techniques that allow greater precision than is available in printed circuit board processing. This allows a first level substrate with a very high I/O pin density to be interfaced to a printed circuit board. The invention also encompasses a method of fabricating a microelectronic package and to a decal and adhesive layer removably mounted to a substrate.</p> |
