Regenerating semiconductor wafers mostly made from silicon comprises determining the extent of damage on the main surfaces of the wafer, grinding and chemical-mechanical polishing the surfaces, and wet chemical cleaning

摘要

Regenerating semiconductor wafers mostly made from silicon comprises determining the extent of damage on the main surfaces of the wafer; grinding and chemical-mechanical polishing the surfaces; and wet chemical cleaning. Preferred Features: The grinding is carried out in the wet state using a diamond abrasive disk. Polishing is carried out in the presence of a polishing solution made from 0.26-normal tetramethylammonium hydroxide solution, 12 % silicon dioxide solution and 8 % aluminum sulfate solution. The wet chemical cleaning is carried out in the presence of 10-50 % hydrofluoric acid.