发明名称 METHODS OF FORMING METAL-COMPRISING MATERIALS AND CAPACITOR ELECTRODES; AND CAPACITOR CONSTRUCTIONS
摘要 The invention includes a method of forming a metal-comprising mass for a semiconductor construction. A semiconductor substrate is provided, and a metallo-organic precursor is provided proximate the substrate. The precursor is exposed to a reducing atmosphere to release metal from the precursor, and subsequently the released metal is deposited over the semiconductor substrate. The invention also includes capacitor constructions, and methods of forming capacitor constructions.
申请公布号 WO03017341(A2) 申请公布日期 2003.02.27
申请号 WO2002US26191 申请日期 2002.08.15
申请人 MICRON TECHNOLOGY, INC. 发明人 YANG, HAINING
分类号 C23C16/18;C23C16/455;H01L21/02;H01L21/28;H01L21/285;H01L21/3205;H01L21/768;H01L21/822;H01L21/8242;H01L27/04;H01L27/108 主分类号 C23C16/18
代理机构 代理人
主权项
地址