发明名称 |
Arrangement for feeding bonding material. |
摘要 |
An arrangement for feeding soldering material into a space between a bolt and rock includes a sleeve-like nozzle which can be pushed tightly against a feed chamber on the rock bolt so that a feed hole in the feed chamber is connected to the inner space of the nozzle. The arrangement further includes a device for placing the nozzle around the feed chamber so that soldering material can be fed from the inner space of the nozzle into the drill hole. |
申请公布号 |
ZA200203561(B) |
申请公布日期 |
2003.02.26 |
申请号 |
ZA20020003561 |
申请日期 |
2002.05.06 |
申请人 |
SANDVICK TAMROCK OY |
发明人 |
VESA PELTONEN;AULIS KATAJA;KIMMO ULVELIN |
分类号 |
E21D20/00;E21D20/02;E21D21/00 |
主分类号 |
E21D20/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|