发明名称 Arrangement for feeding bonding material.
摘要 An arrangement for feeding soldering material into a space between a bolt and rock includes a sleeve-like nozzle which can be pushed tightly against a feed chamber on the rock bolt so that a feed hole in the feed chamber is connected to the inner space of the nozzle. The arrangement further includes a device for placing the nozzle around the feed chamber so that soldering material can be fed from the inner space of the nozzle into the drill hole.
申请公布号 ZA200203561(B) 申请公布日期 2003.02.26
申请号 ZA20020003561 申请日期 2002.05.06
申请人 SANDVICK TAMROCK OY 发明人 VESA PELTONEN;AULIS KATAJA;KIMMO ULVELIN
分类号 E21D20/00;E21D20/02;E21D21/00 主分类号 E21D20/00
代理机构 代理人
主权项
地址