| 摘要 |
PROBLEM TO BE SOLVED: To efficiently peel an electronic component from a sheet member and to prevent it from being damaged by electrostatic discharge. SOLUTION: The peeling apparatus 100 for peeling a semiconductor device 50 held on one of surfaces of a sheet member 3 from the sheet member 3 includes a back stage 20 for sucking a specific region 5 of the sheet member 3 holding the semiconductor device 50, and a needle 30 movably engaged with the back stage 20 for piercing and peeling the semiconductor device 50 from the other surface of the sheet member 3 sucked to the back stage 20. Since the semiconductor device 50 can be separated from the sheet member 3 while the member 3 is sucked in a direction reverse to the direction for piercing and peeling the device 50, efficiency of an operation of peeling the semiconductor device 50 can be improved compared with a case where the device 50 is manually handled, and in addition the device 50 can be prevented from being damaged by electrostatic discharge.
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