METHOD AND DEVICE FOR STICKING SUBSTRATES

摘要

PROBLEM TO BE SOLVED: To prevent a defective from occurring by preventing positional deviation between upper and lower substrates during being carried and keeping a desired distance between the substrates even in the vicinity of an adhesive for temporary fixing. SOLUTION: The positions of the two substrates 33 and 34 provided with an adhesive 37 and the adhesive 53 for temporary fixing are arranged within a evacuated vacuum chamber 15, after that the distance between the substrates is subsequently narrowed down to be subjected to primary application of presence, and the adhesive 53 for temporary fixing in the respective substrates 33 and 34 subjected to the primary application of pressure within the evacuated vacuum chamber 15 is irradiated with UV light to be cured while applying pressure to the adhesive 53 for temporary fixing. Then, the respective substrates 33 and 34 are subjected to application of pressure to be stuck together by returning the inside of the vacuum chamber 15 to atmospheric pressure.